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| International Conferences |
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- K. Machida et al., "A new sensor structure and fabrication process for a single-chip fingerprint sensor/identifier LSI," 1999 IEDM, pp.887-890, 1999.
- H. Ishii et al., "Microfabrication technology for high-speed Si-based systems," SPIE, vol.4230, pp.43-52, 2000.
- M. Urano et al., "Novel fabrication process and structure of a low-voltage-operation micromirror array for optical MEMS switches," 2003 IEDM, pp.965-968, 2003.
- N. Sato et al., "High sensitive structure and its fabrication process for MEMS fingerprint sensor to various fingers," 2003 IEDM, pp.771-774, 2003.
- N. Sato et al., "Novel MEMS power generator with integrated thermoelectric and vibrational devices," Transducers'05, pp.295-298, 2005.
- T. Shimamura et al., "A capacitive-sensing scheme for control of adaptive MEMS device stacked on CMOS LSI," SSDM, pp.56-57, 2006.
- T. Sakata et al., "Prevention of release-related sticking in MEMS devices by electrodeposition of Wwater-repellent film," MNC, pp.394-395, 2006.
- K. Kuwabara et al., "RF CMOS-MEMS switch with low-voltage operation for single-chip RF LSIs," 2006 IEDM, pp.735-738, 2006.
- N. Shimoyama et al., "Effect of scratch stress on the surface hardness and inner structures of a capacitive fingerprint sensor LSI," IRPS, pp.412-416, 2007.
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| Papers |
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| 1) |
K. Machida et al., "Novel global planarization technology for interlayer dielectrics using spin on glass film transfer and hot-pressing in planarization technology," JVST-B, vol.B20, pp.797-801, 2002. |
| 2) |
N. Sato et al., "MEMS fingerprint sensor immune to various finger surface conditions," IEEE Trans. ED, vol.50, pp.1109-1116, 2003. |
| 3) |
K. Kuwabara et al., "Novel structure and fabrication process for integrated RF microelectromechanical-system technology," JJAP, vol.45, pp.6849-6853, 2006. |
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