Research Activities

Commercialized technology Ubiquitous Interface Laboratory
Single-Chip Fingerprint Identification Technology
 
References
 
   1. Papers
  • S. Shigematsu, H. Morimura, Y. Tanabe, T. Adachi, and K. Machida, “A single-chip fingerprint sensor and identifier IEEE Journal of Solid-State Circuits, Vol. 34, No. 12, pp. 1852-1859, Dec. 1999.
  • H. Morimura, S. Shigematsu, and K. Machida, “A novel sensor cell architecture and sensing circuit scheme for capacitive fingerprint sensorsIEEE Journal of Solid-State Circuits, Vol. 35, No. 5, pp. 724-731, May 2000.
  • K. Machida, S. Shigematsu, H. Morimura, Y. Tanabe, N. Sato, N. Shimoyama, T. Kumazaki, K. Kudou, M. Yano, and H. Kyuragi, “A novel semiconductor capacitive sensor for a single-chip fingerprint sensor/identifier LSI IEEE Transactions on Electron Devices, Vol. 48, No. 10, pp. 2273-2278, Oct. 2001.
  • H. Morimura, S. Shigematsu, T. Shimamura, N. Sato, K. Machida, and H. Kyuragi, “Evaluation of Sensitivity on a Capacitive Fingerprint Sensor LSI with a Grounded Wall Structure Japanese Journal of Applied Physics, Vol. 41, Part 1, No. 4B, pp.2316-2321, April 2002.
  • H. Morimura, S. Shigematsu, T. Shimamura, K. Machida, and H. Kyuragi, “A pixel-level automatic calibration circuit scheme for capacitive fingerprint sensor LSIs IEEE Journal of Solid-State Circuits, Vol. 37, No. 10, pp. 1300-1306, Oct. 2002.
  • H. Morimura, S. Shigematsu, T. Shimamura, N. Sato, Y. Okazaki, K. Machida, and H. Kyuragi, “Characteristics of Fingerprint Sensing on Capacitive Fingerprint Sensor LSIs with a Grounded Wall Structure Japanese Journal of Applied Physics, Vol. 41, Part 1, No. 10, pp.5951-5956, Oct. 2002.
  • H. Morimura, S. Shigematsu, T. Shimamura, K. Fujii, C. Yamaguchi, H. Suto, Y. Okazaki, K. Machida, and H. Kyuragi, “An Adaptive Fingerprint-Sensing Scheme for a User Authentication System with a Fingerprint Sensor LSI IEICE TRANSACTIONS on Electronics, Vol.E87-C, No. 5, pp.791-800, May 2004.
  • S. Shigematsu, Y. Tanabe, N. Shimoyama, H. Morimura, Y. Okazaki, and K. Machida, “Effect of Ground-Wall Structure in Capacitive Fingerprint Sensor on Electrostatic Discharge Tolerance Japanese Journal of Applied Physics, Vol. 44, No. 5A, pp.2982-2986, May 2005.
  • S. Shigematsu, H. Morimura, K. Machida, Y. Okazaki, and H. Kyuragi, “Pixel-Parallel Image-Matching Circuit Schemes for a Single-Chip Fingerprint Sensor and Identifier IEICE TRANSACTIONS on Electronics, Vol.E88-C, No. 5, pp.1070-1078, May 2005.
  • S. Shigematsu, K. Fujii, H. Morimura, T. Hatano, M. Nakanishi, N. Ikeda, T. Shimamura, K. Machida, Y. Okazaki, and H. Kyuragi, “Fingerprint Image Enhancement and Rotation Schemes for a Single-Chip Fingerprint Sensor and Identifier IEICE TRANSACTIONS on Electronics, Vol.E89-C, No. 4, pp.540-550, April 2006.
  • S. Shigematsu, Y. Tanabe, T. Shimamura, N. Shimoyama, H. Morimura, M. Nakanishi, and K. Machida, “Logic and analog Test schemes for a single-chip pixel-parallel fingerprint identification LSI IEICE TRANSACTIONS on Electronics, Vol.E90-C, No. 10, pp., Oct. 2007.
  • S. Shigematsu, T. Hatano, H. Morimura, K. Machida, Y. Okazaki, “A Fingerprint Identification System with Wireless Battery-powered Module for Ubiquitous User Authentication IEEJ Transactions of Electrical & Electronic Engineering, Vol. 2, No. 6, pp., Nov. 2007.
 
   2. Conferences
  • S. Shigematsu, H. Morimura, Y. Tanabe, and K. Machida, “A 15×15 mm2 single-chip fingerprint sensor and identifier using pixel-parallel processing International Solid-State Circuits Conference (ISSCC) Digest of Technical Papers, pp. 138-139, Feb. 1999.
  • S. Shigematsu and H. Morimura, “A high-speed pixel-parallel fingerprint identifier for fingerprint identification system on a single chip Proceedings of IEEE ASIC/SoC Conference, pp. 310-314, Sep. 1999.
  • K. Machida, S. Shigematsu, H. Morimura, N. Shimoyama, Y. Tanabe, T. Kumazaki, K. Kudou, M. Yano, and H. Kyuragi, “A new sensor structure and fabrication process for a single-chip fingerprint sensor/identifier LSI International Electron Devices Meeting (IEDM) Technical Digest, pp. 887-890, Dec. 1999.
  • S. Shigematsu, H. Morimura, Y. Tanabe, K. Machida, and H. Kyuragi, “Fingerprint identification system on a single chip based on advanced circuit and device technologies International Conference on Solid State Devices and Materials (SSDM) extended abstract, pp. 352-353, Aug. 2000. (invited)
  • K. Machida, S. Shigematsu, H. Morimura, N. Sato, Y. Tanabe, S. Yagi, H. Ishii, H. Unno, T. Kumazaki, K. Kudou, M. Yano, and H. Kyuragi, “A capacitive sensor structure and process for a single-chip fingerprint sensor/identifier LSI Technical Digest of Sensor Symposium, pp. 143-146, May 2001.
  • H. Morimura, S. Shigematsu, T. Shimamura, K. Machida, and H. Kyuragi, “A pixel-level automatic calibration circuit scheme for sensing initialization of a capacitive fingerprint sensor LSI Symposium on VLSI Circuits Digest of Technical Papers, pp. 171-174, June 2001.
  • H. Morimura, S. Shigematsu, T. Shimamura, K. Machida, and H. Kyuragi, “A single-chip fingerprint sensor/identifier LSI Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD), pp. 243-250, July 2001. (invited)
  • S. Shigematsu, H. Morimura, and K. Machida, “A new sensing and digital-conversion scheme with adaptive image-quality adjustment for a fingerprint sensor chip Proceedings of IEEE ASIC/SoC Conference, pp. 396-400, Sep. 2001.
  • H. Morimura, S. Shigematsu, T. Shimamura, N. Sato, K. Machida, and H. Kyuragi, “Advanced sensing circuit and sensor structure for a high-sensitive capacitive fingerprint sensor LSI International Conference on Solid State Devices and Materials (SSDM) extended abstract, pp. 280-281, Sep. 2001.
  • Y. Tanabe, H. Unno, K. Machida, N. Sato, H. Ishii, S. Shigematsu, H. Morimura, and H. Kyuragi, “Method for testing electrostatic discharge tolerance for fingerprint sensor LSI Proceedings of SPIE, Vol. 4558, pp. 81-88, Oct. 2001.
  • T. Shimamura, H. Morimura, H. Unno, K. Fujii, S. Shigematsu, K. Machida, and H. Kyuragi, “A novel testing scheme for selection of capacitive fingerprint sensor LSIs Proceedings of SPIE, Vol. 4593, pp. 23-30, Dec. 2001.
  • S. Shigematsu, K. Fujii, H. Morimura, T. Hatano, M. Nakanishi, T. Adachi, N. Ikeda, T. Shimamura, K. Machida, Y. Okazaki, and H. Kyuragi, “A 500 dpi 224×256-pixel single-chip fingerprint identification LSI with pixel-parallel image enhancement and rotation schemes International Solid-State Circuits Conference (ISSCC) Digest of Technical Papers, pp. 354-473, Feb. 2002.
  • K. Fujii, M. Nakanishi, S. Shigematsu, H. Morimura, T. Hatano, N. Ikeda, T. Shimamura, Y. Okazaki, and H. Kyuragi, “A 500-dpi cellular-logic processing array for fingerprint-image enhancement and verification Proceedings of Custom Integrated Circuits Conference (CICC), pp. 261-264, May 2002.
  • H. Morimura, S. Shigematsu, T. Shimamura, K. Fujii, C. Yamaguchi, H. Suto, Y. Okazaki, K. Machida, and H. Kyuragi, “An advanced fingerprint sensor LSI and its application to a fingerprint identification system Symposium on VLSI Circuits Digest of Technical Papers, pp. 272-275, June 2002.
  • S. Shigematsu, H. Morimura, K. Fujii, T. Hatano, M. Nakanishi, N. Ikeda, T. Shimamura, Y. Okazaki, Y. Tanabe, K. Machida, and H. Kyuragi, “Software and hardware techniques for a single-chip fingerprint sensor/identifier Proceedings of World Automation Congress [International Forum on Multimedia and Image Processing (IFMIP)], Vol. 13, pp. 123-128, June 2002. (invited)
  • T. Hatano, T. Adachi, S. Shigematsu, H. Morimura, S. Onishi, Y. Okazaki, and H. Kyuragi, “A fingerprint verification algorithm using the differential matching rate Proceedings of International Conference on Pattern Recognition, Vol. 3, pp. 799-802, Aug. 2002.
  • N. Ikeda, M. Nakanishi, K. Fujii, T. Hatano, S. Shigematsu, T. Adachi, Y. Okazaki, and H. Kyuragi, “Fingerprint image enhancement by pixel-parallel processing Proceedings of International Conference on Pattern Recognition, Vol. 3, pp. 752-755, Aug. 2002.
  • S. Shigematsu, T. Hatano, K. Saito, H. Suto, M. Nakanishi, K. Machida, Y. Okazaki, and H. Kyuragi, “New architecture for fingerprint identification system to apply biometrics to various applications Proceedings of International Conference on Knowledge-Based & Intelligent Information & Engineering Systems (KES2002), pp. 1197-1201, Sep. 2002.
  • H. Morimura, S. Shigematsu, C. Yamaguchi, H. Suto, Y. Okazaki, and K. Machida, “An adaptive fingerprint-sensing scheme for a fingerprint identification system with a capacitive fingerprint sensor LSI Proceedings of Sensor Symposium, pp. 327-330, July 2003.
  • H. Morimura, T. Shimamura, K. Fujii, S. Shigematsu, Y. Okazaki, and K. Machida, “A zero-sink-current Schmitt trigger and window-flexible counting circuit for fingerprint sensor/identifier International Solid-State Circuits Conference (ISSCC) Digest of Technical Papers, pp. 122-517, Feb. 2004.
  • K. Machida, H. Morimura, S. Shigematsu, and Y. Okazaki, “Fingerprint sensor LSI Electronics and Communications in Japan, Part 2, Vol. 87, No. 3, pp. 29-38, Mar. 2004. (invited)
  • S. Shigematsu, T. Hatano, H. Morimura, K. Machida, and Y. Okazaki, “A wireless battery-powered fingerprint identification system for ubiquitous user authentication IEEE International Symposium on Consumer Electronics, pp. 600-603, Sep. 2004.
  • H. Morimura, S. Shigematsu, Y. Okazaki, and K. Machida, “Fingerprint sensor technology-sensor structure/chip, sensing scheme, and system Proceedings of International Conference Solid-State and Integrated Circuits Technology, Vol. 2, pp. 1482-1487, Oct. 2004.
  • N. Shimoyama, S. Shigematsu, H. Morimura, T. Shimamura, T. Kumazaki, M. Nakanishi, H. Ishii, K. Machida, “Effect of Scratch Stress on the Surface Hardness and Inner Structures of a Capacitive Fingerprint Sensor LSI Proceedings of International Reliability Physics Symposium (IRPS), pp.412-416, Apr. 2007.
  • T. Shimamura, H. Morimura, N. Shimoyama, T. Sakata, S. Shigematsu, K. Machida, M. Mamoru, “A Fingerprint Sensor with Impedance Sensing for Fraud Detection Proceedings of IEEE International Solid-State Circuits Conference (ISSCC), pp.170-171,604, Feb. 2008.
 
 


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