Top of page
Content Area

Technology

Publications

Publications [2020]

  • M. Mitsuhara et al., “Strain-compensated InGaAsSb/InGaAsSb multiquantum-well structure grown on InP (001) substrate as optical absorber for wavelengths beyond 2 um” in Journal of Crystal Growth, 2020/4.
  • T. Kishi et al., “A 0.57-mW/Gbps, 2ch x 53-Gbps Low-Power PAM4 Transmitter Front-End Flip-Chip-Bonded 1.3-um LD-Array-on-Si” in Proceedings of Optical Fiber Communication Conference (and Exhibition), 2020/3.
  • K. Shikama et al., “Miniature Optical Connector with Magnetic Physical Contact” in Proceedings of Optical Fiber Communication Conference (and Exhibition), 2020/3.
  • Y. Maeda et al., “Si-waveguide Coupled InGaAsP-MQW Photodetector with Large Bandwidth at High Optical Input Power” in Proceedings of Optical Fiber Communication Conference (and Exhibition), 2020/3.
  • T. Aihara et al., “Mach-Zehnder modulator using membrane InGaAsP phase shifters and SOAs inside interferometer arms on Si photonics platform” in Proceedings of Optical Fiber Communication Conference (and Exhibition), 2020/3.
  • Y. Saitou et al., “Tapered Self-Written Waveguide between Silicon Photonics Chip and Standard Single-Mode Fiber” in Proceedings of Optical Fiber Communication Conference (and Exhibition), 2020/3.
  • T. Hashimoto et al., “Automated Optical Waveguide Design Based on Wavefront Matching Method” in Proceedings of Optical Fiber Communication Conference (and Exhibition), 2020/3, (Invited).
  • N. Diamantopoulos et al., “Net 364-Gb/s (4×56-GBaud) PAM-4 SDM Transmission Over 5.9-km 125-μm-Cladding MCF Using III-V-on-Si DMLs” in Proceedings of Optical Fiber Communication Conference (and Exhibition), 2020/3.
  • T. Aihara et al., “Membrane III-V/Si DFB Laser using Uniform Grating and Width-Modulated Si Waveguide” in IEEE J. Lightwave Technol., 2020/3.
  • T. Hiraki et al., “Membrane InGaAsP Mach-Zehnder modulator with SiN waveguide on Si platform” in Proceedings of Photonics west, 2020/2.
  • Z. Xu et al., “A 48GHz BW 225mW/ch Linear Driver IC with Stacked Current-Reuse Architecture in 65nm CMOS for Beyond-400Gb/s Coherent Optical Transmitters” in Proceedings of International Solid-State Circuits Conference (ISSCC), 2020/2.
  • K. Shikama et al., “Reflowable optical connector with glass-ceramic ferrule for advanced pluggable transceiver packaging” in Optical Fiber Technology, 2020/1.

Back to Technology Main Page

Footer Area